Layer 2 Switch and Layer 3 Switch Which Switch to choose?

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What is a Switch?

A switch is a device used to connect several devices in a local network. The switch allows communication between them and the exchange of information and resources.

There are different types of switches, two of the most common are Layer 2 switches and Layer 3 switches. These designations refer to the operating levels and processing capacity of the switches in relation to the OSI (Open Systems Interconnection) reference model.

The choice between a Layer 2 and a Layer 3 switch will depend on the specific needs of the network and the functions required for its proper operation. A Layer 2 switch focuses on communication within a local network using MAC addresses, while a Layer 3 switch goes further and can perform routing between networks using IP addresses.

Layer 2 vs. Layer 3 Switch: Features and Differences

– Layer 2 Switch

A Layer 2 switch (also known as a data link level switch) is used to connect network devices in a LAN (local area network). Its primary function is to send and receive data frames between devices on the same local network. Layer 2 switches use the MAC address of a device to determine which port to send a data frame to.

– Layer 3 Switch

A Layer 3 switch (also known as a network level switch) is used to route data packets between different networks. Layer 3 switches are able to analyse data packets to determine the best network path to send them to their final destination. These switches use IP addresses to make routing decisions.

The main difference between a layer 2 switch and a layer 3 switch is their ability to operate at different layers of the OSI (Open Systems Interconnection) model. While a layer 2 switch focuses on the data link level, a layer 3 switch operates at the network level.

When to choose a Layer 2 switch and a Layer 3 switch?

 

Characteristics Layer 2 switch Layer 3 switch
Principal function Connect devices on a LAN Route data packets between different networks
OSI model layer Layer 2 (data link layer) Layer 3 (network layer)
Addresses used MAC addresses IP addresses
Make decisions of Destination port based on MAC address Network route based on IP address
Traffic management Congestion control and loop prevention Congestion control, loop prevention and QoS (quality of service)
Scalability Limited due to the size of the LAN Higher, due to the ability to route between networks
Security Limited as all devices can be accessed on the same LAN Increased, due to the ability to filter and control traffic between networks
Cost Minor, due to its simplicity and limited functionality Higher, due to its routing capability and advanced functionality

Network Switch Applications for IoT

  • Connect IoT devices: Switches can be used to connect and manage IoT devices on a network. With the number of devices expected to be connected, switches must be able to handle large amounts of traffic and provide high availability.
  • Real-time data processing : To process large amounts of data in real time, which is essential in IoT applications such as temperature control, lighting, etc.
  • Improved energy efficiency : To optimize the energy consumption of IoT devices. This can be accomplished by turning devices on or off as needed, and by allocating resources based on power consumption.

Network switch applications in different verticals.

La elección entre un switch de capa 2 o uno de capa 3 dependerá de los requisitos específicos de la red y las necesidades de cada industria.

The choice between a Layer 2 or a Layer 3 switch will depend on the specific requirements of the network and the needs of each industry.

– Data Center

Layer 2 switch:

  • Connection of servers and network storage devices.
  •  Segmentation of virtual networks (VLAN) for greater security and efficiency.

Layer 3 switch:

  • Implementation of virtualization and cloud technologies.
  • Traffic control and packet prioritization to ensure optimal network performance.

– Industry 4.0

Layer 2 switch:

  • Connection of IoT devices, sensors and actuators in industrial environments.
  • Communication and control of machines and automated systems.

Layer 3 switch:

  • Remote supervision and management of processes and production lines.
  • Implementation of industrial Ethernet networks to improve efficiency and monitoring.

– Transport

Layer 2 switch:

  • Communication systems in public and private transport.
  • Connection of security cameras and video surveillance systems.

Layer 3 switch:

  • Traffic control and intelligent signage.
  • Network management for vehicle fleets and logistics.

– Energy

Layer 2 switch:

  • Monitoring and control of energy distribution networks.
  • Integration of smart meters and energy management systems.

Layer 3 switch:

  • Communication between power generation and distribution devices.
  • Implementation of smart grids for efficient energy management.

Which switch to choose? 

The choice between a Layer 2 or a Layer 3 switch will depend on the specific requirements of the network and the needs of each industry.

At Matrix Electrónica we are specialists and we can help you choose the type of switch you need. Contact us and we will find the best switch option on the market for your specific needs

Contact us for more information

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Managed Switch vs Unmanageable Switch Which Switch to choose?

With Matrix Electrónica SECO increases its presence in the Iberian market

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Arezzo, April 18, 2023 – SECO and Matrix Electrónica proudly announce their partnership agreement for the distribution of SECO product portfolio in the Iberian region. This strategic cooperation will facilitate customers’ access to SECO technology while receiving highly targeted support in the selection of the most suitable solution for their project.

With more than 30 years of experience in the distribution of high-tech products for the industrial market, Matrix Electrónica is a leader in providing electronic equipment, modules and components to developers, system integrators and manufacturers in Spain and Portugal. Its team of specialized R&D engineers can also provide customers with qualified technical support in the implementation of their design.

Through this partnership agreement, SECO now provides Matrix Electrónica access to a comprehensive portfolio of leading edge devices, from standard form factor Computer on Modules and Single Board Computers to ready-to-use HMI and fanless embedded computers. Matrix Electrónica’s know-how and proven expertise will bring added value to this cooperation, not only facilitating access to SECO technology but also delivering the most effective support. With a highly skilled R&D department and specialized vertical competencies, the company can provide customers in many industries with tailored solutions both in terms of hardware and accompanying operating system and BIOS.

“Matrix Electrónica has proven to believe in SECO’s business proposition by establishing a strong, positive relationship since the beginning. Through common technical expertise and knowledge of vertical market needs, I truly believe we will achieve excellent results in a short time.” says Rocco Gagliardi, Sales Manager Southern Europe of SECO, who adds “We are proud to work side by side with this team to improve the presence in the Iberian region, one of the main focuses of both SECO and Matrix.”

“The partnership of Matrix Electrónica and SECO to promote embedded processors in the Iberian market is a natural process, as Matrix has long been the leader in this sector in the market it covers and SECO is already the European leader in this product line. Now Iberian region users will enjoy the best service and the most advanced technology available today, with the guarantee of the top companies in this industry.” says José María Vilallonga Presas, chairman of Matrix Electrónica.

Source: seco.com

SECO product catalogue

Tinker V and Tinker Board 3N

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ASUS IoT announces Tinker V RISC-V SBC and Tinker Board 3N with Rockchip RK3568 SoC

ASUS IoT has added two new members to the Tinker board family with the SBC (Single Board Computer) Tinker V and Tinker Board 3N powered by the Renesas RZ/Five single-core RISC-V SoC and quad-core Arm Cortex-A55 processor. Rockchip RK3568 , respectively.

ASUS Tinker V RISC-V SBC

ASUS Tinker V is the  first SBC with a 64-bit RISC-V processor.
It has 1 Gbyte of DDR4 memory, a microSD card slot for storage, and optional support for a 16 GB eMMC module and SPI flash.

  • 2 Ethernet GbE
  • 1 micro USB
  • 1 micro USB (OTG)
  • 2 CAN Bus (6-pin terminal block)
  • 2 COM RS-232 (5-pin terminal block)
  • 20-pin GPIO header
  • JTAG debug pin header
  • DC power input connector

ASUS Tinker V is ideal for industrial IoT applications, specially designed to run Debian Linux and Yocto. With an ultra-compact size, it offers high power, full functionality and great connectivity, making it a perfect choice for a wide range of industrial IoT applications.

Tinker Board 3N

The 100 x 100mm board incorporates the Rockchip RK3568 , which integrates four ARM Cortex-A55 cores and a Mali-G52 GPU . LPDDR4X RAM memory, with 2 GB, 4 GB or 8 GB available in dual channel.

  • 32 GB and 64 GB eMMC options.
  • MicroSD card reader.
  • M.2 2032 E-Key for connecting Bluetooth/Wi-Fi modems
  • M.2 3042/3052 B-Key for 4G/5G modems.
  • SIM card slot
  • 2 HDMI USB 2.0 and USB 3.2 Gen1 Type-A ports
  • 1 USB 3.2 Gen1 Type-C connection
  • 3.5mm Audio
  • 2 RJ45 ports and a 40-pin GPIO header.
  • Compatible with Android 12 and Debian.

Do you need more info? Our team of specialists is available to help you find the best option for your project. Contact us.

 

Source: “ASUSIoT”

LoRaWAN Solutions – LoRaWAN Devices: Gateway and Sensors

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Standard Wireless Technologies for Smart Buildings

SOLUTIONS BASED ON LORAWAN DEVICES

LoRa is a wireless modulation technique derived from Chirp Spread Spectrum (CSS) technology. Encodes information into radio waves using “chirping” pulses

LoRa is an ideal technology for connections over long distances, where information is communicated that involves little volume of data and the sensors do not have network power.

Due to its high penetration and low cost of implementation, this technology is increasingly used to transmit information inside buildings.

LoRaWAN is a Medium Access Control (MAC) layer protocol built on top of LoRa Modulation. It is a software layer that defines how devices use LoRa hardware.

A typical LoRaWAN network architecture is made up of nodes and gateways .

Characteristics

  • Ultra low power  – LoRaWAN end devices are optimized to operate in low power mode and can last up to 10 years on a single coin cell battery
  • Long range  – LoRaWAN Gateways can transmit and receive signals at a distance of 10 kilometers in rural areas and up to 3 kilometers in dense urban areas.
  • Deep indoor penetration  – LoRaWAN networks can provide deep indoor coverage and easily cover multi-story buildings.
  • License free spectrum  – We do not need to pay a license for the use of the frequency spectrum to implement a LoRaWAN network.
  • High capacity  – LoRaWAN Network Servers can handle millions of messages from thousands of Gateways
  • End-to-end security – LoRaWAN ensures secure communication between the end device and the Network Server using AES-128 encryption.
  • Firmware updates over the air  – Firmware can be updated remotely for a single end device or group of end devices.
  • Low cost  – Minimal infrastructure, low cost end nodes and open source software.
  • Certification program – The “LoRa Alliance certification program” certifies end devices and gives end users the confidence that the devices are reliable and compliant with the LoRaWAN specification.

» LoRaWAN device solutions. Check out our LoRaWAN Gateways and Sensors.

Need more information? Our team of experts is available to help you find the best option for your project. Contact us if you have any questions.

Trends in IoT for Smart Photovoltaic Plants

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Smart Photovoltaic Plants

The smart PV industry has been experiencing steady growth in recent years and is expected to continue in the near future. With the increase in demand for renewable energy and the need to reduce environmental impact, IoT solutions are becoming an essential part of the monitoring and control of these plants.

In 2023, IoT trends for Smart Photovoltaic Plants are expected to include the use of gateways and sensors to improve the efficiency and profitability of these installations. IoT gateways act as a bridge between the sensors and the plant monitoring and control system, allowing two-way communication and real-time data analysis. Sensors , meanwhile, collect information about solar panel performance and environmental conditions, allowing plant operators to make informed decisions to improve performance.

IoT sensors and smart gateways, such as WebdynSunPM , allow constant monitoring of energy production, panel performance and early detection of failures.

IoT solution developers and integrators have great potential in this ever-growing industry and need to be aware of these trends in order to take full advantage of them.

Do you have a photovoltaic solution project? Our team of experts is available to help you find the best option for your project. Feel free to contact us if you have any questions or need help. Make the most of the advantages of solar energy!
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Season’s Greetings! 🎄

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Merry Christmas and a Happy New Year!

Smart Building

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Building an efficient and sustainable future

Smart Building

What is a smart building?

A Smart Building is a structure equipped with innovative technologies that allow communication, management and control with all its systems so that they are automated and monitored.

Through these technologies, all the variables that intervene in and configure the building are controlled and monitored, collecting information on different parameters: air conditioning, lighting, electricity, security, telecommunications, computing, access control, etc.

The data obtained is used for the control and correct operation of the facilities, increasing their safety, usability and accessibility , allowing efficient maintenance and monitoring of incidents. Thus, an intelligent, more sustainable and ecological building is created.

Benefits in a Smart Building

  • Energy saving. Thanks to the intelligent management of the building, better efficiency and the desired comfort are achieved at a lower energy cost, achieving considerable savings through the control of lighting and ventilation.
  • Thermal and light control. They adapt the temperature and intensity of light in the environments according to a schedule to suit the needs of the user.
  • Safety. Smart buildings offer their users security mechanisms and access levels to be able to manage and view the different types of alarms that occur in their different systems, such as fire alarms, existence of high concentrations of harmful gases, floods, unauthorized access, etc. etc.
  • Comfort. The set of technologies that it integrates manages to create a pleasant environment for users in an efficient way.

IoT Wireless Solutions for Smart Buildings

  • Intelligent handling of information.
  • Integration of different magnitudes such as air conditioning, lighting, electricity, security, multimedia telecommunications, computing, access control, etc.
  • Interaction with users.
  • Anticipation of the needs of the occupants.

More information about IoT Wireless Solutions at: BMS & Smart Building – Smart Buildings

→ LoRaWAN Solutions

→ Wireless M-Bus Solution

→ Enless Wireless Solution

→ Wireless Produal Proxima® MESH 2,4 GHz

Do you have a Smart Building project? We are specialized in offering comprehensive solutions for vertical markets. Contact us.

WebdynSunPM RD244/2019 Zero Injection License & Certification

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RD244/2019 Zero Injection License & Certification, in the specific case of zero injection on a photovoltaic energy production.

RD244/2019 Zero Injection

 

WebdynSunPM RD244/2019 Zero Injection License & Certification

This application note describes how to configure and parameter the WebdynSunPM product in the specific case of zero injection on a photovoltaic energy production site in compliance with the Spanish RD 244/2019 standard.

The purpose is to generally explain how zero injection works using an example that has been validated by the CERE certification body.
Using the zero injection script requires a paid license. For any license purchase, please contact us.
Download this new application note and the Cere certificate for the RD244/2019 standard certification.

DOWNLOAD THE APPLICATION NOTE

CERE CERTIFICATION

 

 

 

 

 

 

 

 

 

WebdynSunPM – Main Features

 

 

 

Connect any Modbus device to your LoRaWAN network

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Connect any Modbus device to your LoRaWAN network – easy and fast commissioning, with the unique MLB gateway

 

 

Huge remote monitoring possibilities are opened up for building automation projects by turning Modbus-based field devices into IoT devices by connecting them to a long-range wireless LoRaWAN network. The Low Power, Wide Area (LPWA) network protocol connects all kinds of devices to the Internet, on a public or private network. Our new and exclusive MLB Modbus LoRaWAN gateway is a flexible way to connect any Modbus RTU device from Produal, or third parties, to LoRaWAN.

With the MLB gateway, you can convert Modbus RTU messages to LoRaWAN wireless communications, and read and write registers, to transmit messages such as low weight loads over long distances. Commissioning is conveniently done with the Produal MyTool® mobile app, where you will find ready-to-use description files for the most common Produal Modbus devices. It is also easy to create definition files for any other Modbus device.

The MLB Modbus LoRaWAN gateway is available with an internal or external antenna. Configuration is quick and easy using Produal’s Mytool app for Android systems, which allows various ready-made device profiles and description files to be used in the configuration.

The MLB gateway acts as a Modbus master device and can read and write 32 freely configured Modbus registers via the Modbus RTU bus, allowing two-way communication. Based on the 868 MHz frequency band, the MLB gateway is suitable for European markets.

 

Matrix has more than 30 years of experience in the distribution of technological products for the industrial sector and system integrators. Contact us and we will find the best solution for your project.

Source: Produal 

High-Endurance Low-Latency SD/microSD Cards

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High-Endurance, Low-Latency SD/microSD Cards Built for Dashcams, DVRs Offer Over 109K Hours of Continuous Video Recording

 

 

 

 

 

 

 

ATP Electronics, the global leader in specialized storage and memory solutions, introduces its new 3D triple level cell (TLC) S750/S650 Series SD and microSD memory cards built for the rigors of non-stop video recording. They meet the high endurance, low latency, and built-to-last data storage requirements of dashcams and digital video recorders (DVRs), as well as surveillance systems, autonomous vehicles, and other write-intensive applications.

High Endurance Over 109K Hours1of Recording Time in Native TLC

Video evidence can prove critical in many scenarios; hence, it is very important for SD/microSD cards to record non-stop without compromising image quality and integrity. The S650 Series can record Full HD videos continuously up to 109,401 hours — far longer than similar cards marketed as “high endurance.” The S650 Series is based on 5K program/erase (P/E) cycles, which translate to 1.6X higher endurance than typical memory cards with 3K P/E cycles. The S750 Series, configured as pseudo single-level cell (pSLC) is based on 60K P/E cycles, while typical pSLC memory cards are rated for around 20K to 30K P/E cycles.

The following graph2 shows the endurance simulation result of ATP S650 128 GB microSD compared with other high-endurance branded cards of the same capacity, in full HD mode.

High Endurance Maximum Recording Hours: ATP S650 vs. Other High-Endurance Cards

High Endurance Maximum Recording Hours: ATP S650 vs. Other High-Endurance Cards

Notes:
1 Tested using 128 GB ATP S650 TLC card based on 13 Mbps (lowest bitrate of HD recording) in best-case/ideal scenario, with no other influencing factors.
2Information sourced by ATP from publicly available data. To record new data, the oldest data will be overwritten when the card is full. 1Mbps=1,000,000 bps

Low Latency: Ready to Record in <1 Second, Writes 50% Faster

After power on, drive recorders may have to wait a few seconds to be ready for recording. The time between the first read command and the first write command from host is the “response time.” ATP S650 and S750 Series cards take less than 1 second response time while normal cards may take 7 to 12 seconds based on real tests on a DVR at room temperature. While recording 16 MB data sequentially, ATP S650 cards take less than 0.1 second, saving 50% of writing time compared with consumer-rated cards and enabling high-speed backup without data loss.

Own HW/FW Design Features Offer Precise Reliability

As a true manufacturer with its own hardware/firmware capability, ATP can adjust to a variety of usages to fulfill customers’ specific application requirements and conditions. Based on customers’ applications, ATP does its best to meet the requirements by unique FW and HW design.

  • Auto-Read Calibration (ARC). Over time and with constant use, NAND flash memory cells degrade, causing voltage shifts that increase bit error rates (BER). When the normal Read Retry function is not enough to recover the errors, a more precise “Auto Read Calibration” (ARC) is applied to assure data integrity at extreme temperature or degraded NAND cells.
  • ATP Methodology for Advanced Card Analysis. ATP memory cards are IP67/IP57-certified and manufactured using System-in-Package (SiP) wafer/die process, making it difficult to do component analysis compared to SMT (surface- mount technology) process. ATP’s uniquely designed substrate and debug tool make this mission “possible.”
  1. ATP-Developed Hardware Design – Substrate with reserved testing pin is available for future component analysis.
  2. Solder Mask Removal by Laser – Precise and efficient method to remove solder mask so as to reach the reserved testing pins on the substrate.
  3. ATP’s Own Customized Debug Tool – This is connected to the HW reserved testing pin and then linked to the SW analysis system.

Specifications

 

→Industrial Memory Cards

 

Source: ATP Electronics Taiwan Inc.

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